-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha's Pujari to Present on Interconnection for Floating PV Applications at Intersolar India
December 4, 2018 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions is participating in the upcoming Intersolar India taking place December 11–13, 2018, in Bangalore, India.
Narahari Pujari, R&D manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper on a review of interconnection technology for floating PV applications that critically assesses various cell designs, material and techniques to join cells for floating PV assemblies.
"It is reported that 40.7% of cSi PV (photovoltaic) modules fail at interconnection in a module’s lifespan. This risk is even higher in floating PV applications. This is due to high moisture content and corrosion resulting from adverse environmental conditions as well as instability in times of inclement weather, hazardous condensation in the interior, etc.," said Pujari. "Additionally, joints that are exposed to fatigue loading and vibrations have shown metal segregation, grain boundary coarsening/cracking, increased series resistance and heating issues. The industry is still evaluating interconnection options in new cell designs. All these make the review of interconnection technologies employed in floating PV imperative."
Pujari's paper will demonstrate the role of non-corrosive flux and EVA compatibility studies. In addition, use of lead-free soldering and solder paste technologies to support the current design trend of new cell architectures will be presented. Both options are cost efficient and could improve the module performance and consequently extend the mean-time-to-failure (MTTF).
2018 Intersolar India
Date: Tuesday December 11, 2018 – Thursday December 13, 2018
Venue: Bangalore, India
Presentation: A Review of Interconnection Technologies for Floating PV Application
Date: December 12, 2018
Time: 11:35 am
Presented by: Narahari Pujari, R&D manager, Alpha Assembly Solutions
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.