Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
ESI Launches New Laser Drilling System for HDI Rigid PCB Manufacturing
December 4, 2018 | ESIEstimated reading time: 1 minute
Electro Scientific Industries Inc. has launched its Geode laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB). This new entry combines a CO2 laser and advanced beam control capabilities to deliver improved throughput and accuracy from a system that is significantly smaller and lighter than current competitive offerings. The system's sophisticated beam steering and pulse shaping technologies provide the flexibility and control that will be required for 5G applications using high-frequency compatible materials and finer-pitched interconnects fabricated with modified semi-additive processes (mSAP).
"The Geode leverages ESI’s decades of experience in laser optics and laser-material interaction to deliver a system that out performs and out produces anything on the market," stated John Williams, vice president of marketing, ESI. "Other HDI laser systems are based on legacy mechanical drilling platforms that were large and heavy, the Geode system’s design is based on a lighter-weight, smaller-footprint platform that is purpose-built from the ground up specifically for HDI laser processing. This design not only helps Geode meet the high-accuracy, high-throughput requirements of processing applications such as 5G, but also makes it a more cost-effective platform for our customers to install and maintain."
The Geode system uses a powerful 9.4µm pulsed CO2 laser, emitting infrared radiation ideally-suited for rigid PCB materials. Its HyperSonix technology shapes laser pulses to improve throughput and via quality. AcceleDrill distributes pulse energy to improve throughput and via metrics and also permits multiple via sizes in a single pass. VDC (via density compensation) controls local heating to minimize heat-affected zones and improve accuracy, throughput and diameter stability. The Geode system is the first CO2 laser via drilling system to incorporate such high level beam control and beam steering technologies.
ESI is currently exhibiting at the HKPCA & IPC Show 2018, being held this week in Shenzhen, China. EIS is at Booth 1Q01.
Share on:
Suggested Items
LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory
05/01/2025 | PR NewswireLG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
The EEcosystem and Dr. Eric Bogatin Launch Free Masterclass for Electronics Engineers
05/01/2025 | The EEcosystemThe EEcosystem, a podcast media and education brand serving professional electronics engineers, is proud to announce the launch of a new online learning platform: The EEcosystem Electronics Masterclass. The platform debuts with Transmission Lines 101, a free course created in partnership with world-renowned signal integrity expert Dr. Eric Bogatin. The course will be available starting May 1, 2025.
Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance
04/29/2025 | BUSINESS WIREKasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.
OSI Systems Receives Orders for $50 Million to Support the Deployment of Cargo and Vehicle Inspection Solutions
04/29/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received multiple awards totaling approximately $50 million from an existing U.S. customer to support the ongoing deployment of its industry leading Rapiscan Cargo and Vehicle Non-Intrusive Inspection technology.