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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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2019 IPC APEX EXPO Call for Posters
December 11, 2018 | IPCEstimated reading time: Less than a minute
Gain significant visibility for you and your company on your research and knowledge by creating a technical poster at one of the industry's premier conferences on electronics manufacturing. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, January 30, 2019 offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, January 30, 2019.
Deadline for Abstracts: Monday, December 17, 2018
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EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 16, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
IMI Wins Gold Award for Best Managed Technology Company at FinanceAsia’s 29th Asia’s Best Companies Awards
07/01/2025 | IMIIntegrated Micro-Electronics Inc. (IMI) has been awarded the prestigious Gold Award for Best Managed Technology Company at the 29th edition of the Asia’s Best Companies Awards, hosted by FinanceAsia.