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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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2019 IPC APEX EXPO Call for Posters
December 11, 2018 | IPCEstimated reading time: Less than a minute
Gain significant visibility for you and your company on your research and knowledge by creating a technical poster at one of the industry's premier conferences on electronics manufacturing. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, January 30, 2019 offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, January 30, 2019.
Deadline for Abstracts: Monday, December 17, 2018
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
The Global Electronics Association Launches Design Village at APEX EXPO 2026
09/02/2025 | Global Electronics AssociationAPEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry.
Compal Establishes Japan Office to Accelerate Growth in Automotive Infrared Sensing Market
09/02/2025 | Compal Electronics Inc.Compal Electronics, Inc., a global leader in electronics manufacturing headquartered in Taipei, Taiwan, announced the establishment of its Japan office in Minato-ku, Tokyo.
Koh Young Highlights the Market Driven Nova Series and Smart Factory Solutions at Productronica India 2025
09/02/2025 | Koh YoungKoh Young, the global leader in True 3D measurement‑based inspection and smart factory platforms, is poised to highlight its cutting‑edge technologies at Productronica India 2025, running from September 17–19 at the Bangalore International Exhibition Centre (BIEC).
September 2025 SMT007 Magazine: An Eye on India
09/02/2025 | I-Connect007 Editorial TeamIndia is on track to become the world’s fastest-growing major economy within the next two years, and that momentum is already reshaping its electronics manufacturing sector. Whether you work with Indian suppliers or serve Indian customers, chances are the country will become a bigger part of your supply chain in the near future.
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: