Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Gen3 Introduces AutoSIR2 + and AutoCAF2+
December 13, 2018 | Gen3 SystemsEstimated reading time: 1 minute
SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.
As an example, the evolution of electric vehicles and driverless technology AKA EV’s, show that the three phase developments will be 470V; 850V and 1,250V continuous operation. Testing under these conditions requires extreme health and safety precautions, especially as the tests are performed in damp / heat chambers at typically 850C / 85% RH for up to and beyond 2,500 hours.
Other applications however, show demand for ultra-low voltage testing at
Gen3 has a continuous product development program to meet the ever-changing demands of both our existing and new customers. We are proud to introduce the new AutoSIR2+ and the AutoCAF2+ instruments.
These incorporate new and greatly improved software that provides superior flexibility and which also permit simultaneous tests at up to 4 different voltages. The user can select 3 voltages from the choice of 0V; 3.3V; 5V; 10V; 12.5V; 15V; 50V and 100V. In addition, by using an external power supply, an additional test may, simultaneously, be run at up to 1,250V.
The Gen3 Systems AutoSIR2+ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows for state-of-the-art accuracy resistance measurements to be made up to 1014 Ω.
About Gen3 Systems
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field. In addition, the company designs and manufactures dip and spray coating process equipment in both in-line and bench-top formats. Gen3 is a specialist distributor for several leading equipment manufacturers including, Nordson SELECT, FineTech, MBTech, MEK, Hirox, and, Aprotec Instrumentation, solder paste inspection (SPI) systems.
Gen3 Systems also provides training, equipment and expertise for manufacturers requiring assessment of their electronic products’ reliability. The company also operates a test service and assists with standards development via both the IPC, IEC, and UL. Gen3 Systems operates from premises near Farnborough Business Park, on the M3 corridor and just 30 minutes from London’s Heathrow Airport.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.