-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec International Group Receives Consent for IPO on Taiwan Stock Exchange
December 21, 2018 | Ventec International GroupEstimated reading time: Less than a minute
Ventec International Group Co. Ltd has received formal consent from the Taiwan Stock Exchange (TWSE) on its Initial Public Offer (IPO) application. The completion date is set for April 2019.
Ventec filed its final IPO application with the TWSE in October 2018 and the approval comes after a successful presentation to the Listings Review Committee at the beginning of December. The Paid-in Capital and Total Equity at the time of application for the listing was NT$ 646,143 thousand / NT$ 1,648,711 thousand. Among the conditions set by the TWSE for the approval is that Ventec release a further 10% of public shares before the completion date.
"We are proud to have received the official consent from the TWSE today and look forward to an expeditious launching of the public offer and successful listing of our shares in Taiwan," said Jason Chung, CEO. "This outstanding achievement is based on the strength and dedication of our global team and I am truly thankful for everyone's hard work that ensures Ventec’s success."
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.