-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nordson SELECT Integra 508.3 to Make its North American Debut at IPC APEX EXPO 2019
January 10, 2019 | Nordson SELECTEstimated reading time: 2 minutes
Nordson SELECT, a Nordson company, has announced that its Integra 508.3 will make its North American debut at the 2019 IPC APEX Expo, scheduled to take place January 29-30, 2019 at the San Diego Convention Center in San Diego, California.
The Integra 508.3 is a multi-station selective soldering system designed for high-volume applications with maximum throughput. With its flexible configuration, the Integra 508.3 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. When configured with dual drop-jet fluxers and dual solder pots, the Integra 508.3 can solder two boards at the same time in each soldering station. When operated in the parallel mode, the Integra 508.3 can process up to six boards at one time significantly increasing machine productivity.
Also featured will be a range of selective soldering systems for various applications, including the award-winning Integra 103ILD, the versatile Cerno 103IL, and the compact Novo 300.
The Integra 103ILD is a dual pot selective soldering system and features Nordson SELECT’s unique automatic solder nozzle tinning system. Unlike other nozzle cleaning systems, Nordson SELECT’s patent pending system does not spray an adipic acid, or a liquid or powdered flux. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any resulting overspray or contamination of the printed circuit board or the selective soldering machine.
Nordson SELECT’s Cerno 103IL is a fully-configured SMEMA compatible selective soldering system equipped with standard features including interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys. The Cerno 103IL comes standard with an automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of a printed circuit board. The system also features board mapping and pattern recognition of a correct board assembly, x-out circuits or missing components.
Also on display will be the Novo 300, an entry lvel selective soldering platform with a compact footprint requiring less than 1.1 square meters of factory floor space. The Novo® 300 is a standalone platform that is ideally suited for prototype, cell manufacturing or small batch production.
About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.