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Dorigo Expands Depanelizing Capabilities
March 11, 2019 | Dorigo SystemsEstimated reading time: Less than a minute
Dorigo recently installed a semi-automatic depanelizing systems to enhance its printed circuit board assembly (PCBA) production capabilities.
"At Dorigo Systems, we find that many of our customers' designs have components very near the edge of the boards," says Paul Vasvary, business development manager. "The ultra-high densities of assemblies these days often require a depaneling router to ensure that the components do not get damaged when the individual PCBAs are removed from the panel."
The new machine, an ASYS Divisio 2100 Ergo, provides speed and pin-point accuracy to Dorigo's depaneling process. Another important feature of the system is that it enables Dorigo to depanel round or odd-shaped boards with very tight tolerances, in situations where an assembly needs to fit into a precision enclosure, according to Vasvary.
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IMAPS & IPC to Host Onshoring Workshop
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