Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
IMAPS & IPC to Host Onshoring Workshop
April 16, 2024 | IPCEstimated reading time: 2 minutes
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
This workshop will bring together Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly stakeholders to discuss their ongoing efforts to develop advanced packaging capability onshore. The mission of this event is to engage the domestic semiconductor industry by providing updates on US Government and Defense initiatives that are critical to the onshoring of the microelectronic assembly and packaging supply chain. Advanced packaging initiatives lead by numerous Government agencies, including the Department of Commerce/NIST (ME Commons, NAPMP and NSTC), DoD (RESHAPE, SHIP, STAM, STEAM PIPE, SCALE, IBAS, Title III), and DARPA (NGMM) will be presenting.
The workshop will feature three days of program focused sessions, informative keynote presentations, a work force development session, panel discussions and a variety of networking opportunities. The event will kick-off on Monday April 29th with a pre-program day with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging. The 2024 workshop also features opportunities for sponsorship and tabletop exhibitors.
Attendees can help shape another successful Onshoring Workshop by contributing their valuable insight! A United States Passport is required for registration.
Keynotes include:
- Ms. Adele Ratcliff, Director of Innovation Capability and Modernization (ICAM) Office
- Dr. Dev Palmer, Next-Generation Microelectronics Manufacturing (NGMM) Program Managing Director, DARPA
- Dr. Dev Shenoy, Office of the Undersecretary of Defense, Director of the Defense Microelectronics Cross Functional Team
- Dr. Eric Lin, Deputy Director, CHIPS Research and Development Program
- Dr. George Orji, Deputy Director, Chips NAPMP
- Dr. Joshua Hawke, Navy, OUSD R&E RF/OE Initiatives, Technical Execution Area Lead
- Ms. Molly Just, Director of CHIPS Coordination Cell, OUSD A&S
Comment from the Technical Program Chair:
“With the exceptional engagement of our Technical Steering Committee members, we have assembled a comprehensive program for this year’s Workshop with representation from all of the US Government and Defense agencies that are tasked with driving the advanced packaging onshoring efforts and associated supply chain stakeholder enhancements. During this event, attendees will be updated directly from DoD leaders and their industry performers on current and future programs that will address and inform U.S. Government advanced packaging roadmaps. This workshop also provides outstanding opportunities to interface with multiple levels of Government leadership, the Defense Industrial Base, and Commercial Suppliers, all of whom share a common goal to make the USA more self-sufficient in microelectronics manufacturing.” ~ Ted Tessier, IBM
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.
Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition
08/28/2025 | Amkor TechnologyAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced the City of Peoria, Arizona successfully bid as part of a State Land Auction to acquire 834.5 acres for future development.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.