-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IMAPS & IPC to Host Onshoring Workshop
April 16, 2024 | IPCEstimated reading time: 2 minutes
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
This workshop will bring together Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly stakeholders to discuss their ongoing efforts to develop advanced packaging capability onshore. The mission of this event is to engage the domestic semiconductor industry by providing updates on US Government and Defense initiatives that are critical to the onshoring of the microelectronic assembly and packaging supply chain. Advanced packaging initiatives lead by numerous Government agencies, including the Department of Commerce/NIST (ME Commons, NAPMP and NSTC), DoD (RESHAPE, SHIP, STAM, STEAM PIPE, SCALE, IBAS, Title III), and DARPA (NGMM) will be presenting.
The workshop will feature three days of program focused sessions, informative keynote presentations, a work force development session, panel discussions and a variety of networking opportunities. The event will kick-off on Monday April 29th with a pre-program day with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging. The 2024 workshop also features opportunities for sponsorship and tabletop exhibitors.
Attendees can help shape another successful Onshoring Workshop by contributing their valuable insight! A United States Passport is required for registration.
Keynotes include:
- Ms. Adele Ratcliff, Director of Innovation Capability and Modernization (ICAM) Office
- Dr. Dev Palmer, Next-Generation Microelectronics Manufacturing (NGMM) Program Managing Director, DARPA
- Dr. Dev Shenoy, Office of the Undersecretary of Defense, Director of the Defense Microelectronics Cross Functional Team
- Dr. Eric Lin, Deputy Director, CHIPS Research and Development Program
- Dr. George Orji, Deputy Director, Chips NAPMP
- Dr. Joshua Hawke, Navy, OUSD R&E RF/OE Initiatives, Technical Execution Area Lead
- Ms. Molly Just, Director of CHIPS Coordination Cell, OUSD A&S
Comment from the Technical Program Chair:
“With the exceptional engagement of our Technical Steering Committee members, we have assembled a comprehensive program for this year’s Workshop with representation from all of the US Government and Defense agencies that are tasked with driving the advanced packaging onshoring efforts and associated supply chain stakeholder enhancements. During this event, attendees will be updated directly from DoD leaders and their industry performers on current and future programs that will address and inform U.S. Government advanced packaging roadmaps. This workshop also provides outstanding opportunities to interface with multiple levels of Government leadership, the Defense Industrial Base, and Commercial Suppliers, all of whom share a common goal to make the USA more self-sufficient in microelectronics manufacturing.” ~ Ted Tessier, IBM
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California
10/31/2024 | StratEdgeStratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.