It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
MacDermid Alpha Opens Tech and Applications Center in Taiwan
March 29, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions officially opened a Global Development Application Center (GDAC) at No. 20, Andong Rd., Zhongli District, Taoyuan City, Taiwan R.O.C on March 19, 2019. Scot Benson, President and Chief Operating Officer, and Joe D’Ambrisi, Senior Vice President, accompanied Harry Yang, General Manager for Taiwan, cut the ribbon to officially open the new facility. Several important customers, tier one manufacturers, and industry representatives joined the company’s top management for the historic moment. The advanced technology and application center will house sales, technical service, customer service, and office personnel alongside the laboratory staff.
Harry Yang said, “With MacDermid Alpha Taiwan's unique role as a chemical and materials supplier to all steps of the electronics manufacturing supply chain, this US$ 4 million investment to build a highly optimized technical center is the next step in a long journey to our goals. With these new capabilities, we can foster not only local, but also cross-strait development of advanced printed circuit board and IC substrate manufacturing processes. Additionally, the facility enables study of MacDermid Alpha’s assembly materials, semiconductor packaging processes, and wafer interconnection in a way that optimizes every material within an electronic device.”
The first floor of the applications development technology center houses an advanced IC substrate and metallization process pilot line which features equipment specific for ultra-fine line processing. The second floor houses our wafer level packaging applications laboratory with capabilities for the testing of solder ball, micro solder spheres, reflow metrology, and a fully functional tool for wafer level tin bumping. Production-scale wet processing equipment lines are located on the third floor, along with a complete chemical analysis laboratory containing high-precision instruments for comprehensive customer service. Following the company’s emphasis on innovation and service, the facility will host training of regional MacDermid Alpha Taiwan technical service staff, conduct in-depth product development and pilot studies, and leverage the advanced equipment available on-site and at our customers in the area. Engineer training and project planning will be conducted on the fourth floor R&D training center.
Yang continued, “We really hope that through these investments and new capabilities, we can assist regional companies achieve their goals and allow new growth opportunities in Taiwan’s electronics industry as a whole.”
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.