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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Posters Sought for IPC APEX EXPO 2020
September 5, 2019 | IPCEstimated reading time: Less than a minute
IPC is inviting the industry to submit technical posters for the upcoming IPC APEX EXPO 2020. Delivering a technical poster at the industry's premier conference on electronics manufacturing provides significant visibility for you and your company on your research and knowledge.
Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the global electronics industry. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, February 5, offering additional visibility.
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
The deadline for submission of abstracts is November 15, 2019.
To submit posters, click here.
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Sweeney Ng - CEE PCBSuggested Items
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