Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

Exploring Innovation Through Alternate Metals and Sputtering

11/11/2024 | Marcy LaRont, I-Connect007
Dr. Evelyne Parmentier has a PhD in physical chemistry from ETH Zurich. She was born in Luxembourg and is now a proud resident of Switzerland, where she has been part of Dyconex’s R&D engineering team for the past two years. Evelyne gave a presentation at the EIPC Summer Conference titled “Functionalization of Printed Circuit Boards Through Introducing Alternate Metals Through Sputtered Layers,” where she asked her audience, “If there are 93 metals in the periodic table, why are we not using more of them?”

Altair PollEx for ECAD Now Available

11/08/2024 | Altair
Altair, a global leader in computational intelligence, announced it is providing engineers access to advanced printed circuit board (PCB) verification tools at no cost with Altair® PollEx™ for ECAD.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4

10/03/2024 |
Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.

Requirements & Systems Portal Application Now Available on the Altium 365 Cloud Platform

09/13/2024 | Altium
Altium, a global leader in electronics design systems, announced today that it has launched the Requirements & Systems Portal Application into the Altium 365 cloud platform for electronics design collaboration.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in