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Advanced Electronics Packaging Digest

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Infineon, Siemens Deploy Silicon Carbide Technology to Modernize Electrical Protection

06/09/2026 | Infineon
Infineon Technologies AG and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems.

Siemens, Partners Launch Reference Architecture for NVIDIA AI Data Centers

06/03/2026 | Siemens
Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls architecture for hyperscalers, colocation providers, and specialized cloud infrastructure providers.

Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/20/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

PTC Onshape Introduces Direct Altium Integration to Streamline ECAD-MCAD Collaboration

05/12/2026 | PRNewswire
PTC announced a new integration between its cloud-native Onshape® computer‑aided design (CAD) and product data management (PDM) platform and Altium.
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