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Advanced Electronics Packaging Digest

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Suggested Items

Elementary, Mr. Watson: The ‘Baton’ Handoff Makes or Breaks the Design

09/03/2026 | John Watson -- Column: Elementary, Mr. Watson
In my previous column in I-Connect007 Magazine, I shared the example of the U.S. men’s 4x100-meter relay team at the Tokyo 2020 Olympics. Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie were among the fastest sprinters in the world. Reaching the final seemed almost certain. Instead, they finished sixth in their qualifying heat and missed advancing by only two-hundredths of a second. The problem was not speed, experience, or talent. It occurred during the baton exchange. Their failure demonstrated that being exceptional at an individual role does not guarantee collective success. A race can be lost not during the individual legs, but during the brief moments when responsibility changes hands.

Siemens to Invest Over $200 Million, Add 1,500 U.S. Jobs in Electrical Infrastructure Push

08/10/2026 | Siemens
Building on its recent milestone of more than $1 billion invested in U.S. manufacturing over the past five years, Siemens announced a combined investment of over $200 million in new manufacturing facilities in Pendergrass, Georgia and Grand Prairie, Texas that will expand its U.S. electrical infrastructure manufacturing footprint and create more than 1,500 jobs.

Designing for the Human Eye: Three Lessons Every PCB Designer Should Know About LED Displays

08/06/2026 | Stephen V. Chavez, Siemens EDA and PCEA
A display is one of the few electronic subsystems where PCB design decisions become visible to the end user. A few milliohms of resistance, a slight impedance discontinuity, or a few degrees of temperature difference may never matter elsewhere in the product. In an LED display, however, those same design decisions can become a visible defect. Behold the power of the human eye. Over the years, I've reviewed hundreds of PCB layouts spanning everything from industrial controls and aerospace electronics to medical devices and high-speed computing systems. Every design presents its own unique challenges, but display electronics have always stood apart.

Bell Awarded Contract for SPINE Upgrades to H-1 Fleet

07/28/2026 | Bell
Bell Textron Inc., a Textron Inc. company, has announced an estimated $300 million, firm-fixed-price, fixed-price incentive, and cost-plus-fixed-fee contract from the Department of Navy.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.
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