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Advanced Electronics Packaging Digest

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Suggested Items

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

ArchKey Expands Platform With US Communications & Electric Acquisition

10/02/2026 | PRNewswire
ArchKey, a scaled, national electrical and technology systems provider, announced the acquisition of US Communications & Electric, a Cleveland-based technology integration firm specializing in audio-visual systems, distributed antenna systems (DAS), network infrastructure, security solutions and connected building technologies.

UL Solutions Completes Acquisition of Eurofins Scientific’s Electrical & Electronics Business

10/02/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced it has completed the acquisition of the electrical and electronics (E&E) business of Eurofins Scientific SE.

Aismalibar North America to Showcase Advanced Thermal Management Materials at PCB West 2026

09/29/2026 | Aismalibar
Aismalibar North America will showcase advanced thermal interface materials, thermally conductive PCB materials and insulated metal substrates at PCB West 2026 on Wednesday, September 30, at the Santa Clara Convention Center in Santa Clara, California.

Flex Connections: Material Selection in Nickel vs. Copper Tabs

09/17/2026 | Zack Schaner -- Column: Flex Connections
Flexible printed circuits are being designed to do more than route signals. In many applications, the flex circuit must also provide robust electrical interfaces, mechanical reinforcement, and reliable transitions between the circuit and surrounding assemblies. One effective way to accomplish this is by integrating copper or nickel tabs directly into a flexible printed circuit.
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