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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.

July I-Connect007 Magazine: Business Diversification and Display Electronics

07/15/2026 | I-Connect007 Editorial Team
This month's I-Connect007 Magazine explores two critical challenges facing today's electronics industry: how PCB fabricators can build more resilient businesses through strategic diversification, and how PCB designers can successfully tackle the unique demands of modern display electronics.

One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

06/17/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.

Infineon, Siemens Deploy Silicon Carbide Technology to Modernize Electrical Protection

06/09/2026 | Infineon
Infineon Technologies AG and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems.
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