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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Designing for the Human Eye: Three Lessons Every PCB Designer Should Know About LED Displays

08/06/2026 | Stephen V. Chavez, Siemens EDA and PCEA
A display is one of the few electronic subsystems where PCB design decisions become visible to the end user. A few milliohms of resistance, a slight impedance discontinuity, or a few degrees of temperature difference may never matter elsewhere in the product. In an LED display, however, those same design decisions can become a visible defect. Behold the power of the human eye. Over the years, I've reviewed hundreds of PCB layouts spanning everything from industrial controls and aerospace electronics to medical devices and high-speed computing systems. Every design presents its own unique challenges, but display electronics have always stood apart.

Bell Awarded Contract for SPINE Upgrades to H-1 Fleet

07/28/2026 | Bell
Bell Textron Inc., a Textron Inc. company, has announced an estimated $300 million, firm-fixed-price, fixed-price incentive, and cost-plus-fixed-fee contract from the Department of Navy.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.

July I-Connect007 Magazine: Business Diversification and Display Electronics

07/15/2026 | I-Connect007 Editorial Team
This month's I-Connect007 Magazine explores two critical challenges facing today's electronics industry: how PCB fabricators can build more resilient businesses through strategic diversification, and how PCB designers can successfully tackle the unique demands of modern display electronics.

One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.
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