Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

06/17/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.

Infineon, Siemens Deploy Silicon Carbide Technology to Modernize Electrical Protection

06/09/2026 | Infineon
Infineon Technologies AG and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems.

Siemens, Partners Launch Reference Architecture for NVIDIA AI Data Centers

06/03/2026 | Siemens
Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls architecture for hyperscalers, colocation providers, and specialized cloud infrastructure providers.

Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in