-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Critical Manufacturing and Qingdao Topscomm Sign MES Cooperation Agreement
September 24, 2019 | Critical ManufacturingEstimated reading time: 2 minutes
Critical Manufacturing, an ASM PT company, has signed a cooperation agreement with Qingdao Topscomm Communication Co. Ltd for a manufacturing execution systems (MES) project at Topscomm's headquarters. Qingdao Topscomm is a leading technology company with intellectual property rights in the fields of communication, electronic technology, integrated circuits and systematic electronic products. Topscomm will implement Critical Manufacturing MES in three factories in Qingdao, each respectively focusing on injection molding, mold and electronics manufacturing.
Wu Shi Jun, CIO of Topscomm, stated, "Our goals for the MES project are to improve our material logistics and automation efficiency. We will be able to lower costs, reduce the number of operators, improve production transparency and manage and maintain equipment more effectively. We plan to move to automated production planning and upgrade our automated production to create truly efficient and intelligent smart factories."
Critical Manufacturing was selected because of its modern architecture and advanced Industry 4.0, equipment integration and automation capabilities. Topscomm's strong relationship with ASM Assembly Systems Ltd was an important factor because of its long and successful partnership over the past 20 years.
Dave Trail, VP Electronics Segment at Critical Manufacturing, said, "The combination of vast SMT (surface mount technology) equipment and process knowledge and the joint ASM and Critical Manufacturing strategic roadmap for enabling the smart factories of the future make Critical Manufacturing MES the perfect solution to meet Topscomm's needs. Our MES software will provide Qingdao Topscomm with a complete intelligent solution to help integrate and coordinate many different brands of equipment, robots and software systems. It will also enable intelligent logistics, lean production, automatic scheduling, zero defect quality management, and advanced production visualization and analytics, thereby increasing production efficiency, reducing costs and shortening production cycles."
Wu Shi Jun, CIO of Topscomm, added, "The Critical Manufacturing MES solution will allow us to transform efficiencies and become a paragon for Smart Manufacturing in Greater China. In the future, we look forward to collaborating with Critical Manufacturing and ASM to demonstrate our intelligent factories as part of their smart network reference program."
About Critical Manufacturing
Critical Manufacturing provides the most modern, flexible and configurable manufacturing execution system (MES) available. Critical Manufacturing MES helps manufacturers stay ahead of stringent product traceability and compliance requirements; reduce risk with inherent closed-loop quality; integrate seamlessly with enterprise systems and factory automation, and provide deep intelligence and visibility of global production operations.
As a result, customers are Industry 4.0 ready. They can compete effectively and profitably by easily adapting their operations to changes in demand, opportunity or requirements, anywhere, at any time. For more information, visit www.criticalmanufacturing.com.
About ASM Pacific Technology Limited
As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, LED and alternative energy. Our continuous investments in research and development help to provide our customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality.
Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Hong Kong 35 Index and the Hang Seng Global Composite Index. To learn more about ASMPT, please visit our website at www.asmpacific.com.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.