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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Unitech, Dynamic Doing Well With Multiple Niche PCB Applications
October 14, 2019 | DigitimesEstimated reading time: Less than a minute
Taiwan-based PCB makers Unitech and Dynamic Electronics have outperformed other local second-tier peers, as their efforts in developing diverse niche applications are paying off significantly.
Unitech, now in the supply chain of rigid-flex boards for AirPods, has seen its revenues grow steadily since the launch of AirPods 2 in early 2019. The company sees AirPods-use boards contribute 30-40% of its revenues. The company has also started shipments of battery boards for iPhone 11 series and will deliver boards for auto-use camera lens and radar modules starting in early 2020.
Dynamic has enjoyed steady increases in demand for HDI boards from three major application segments: auto-use camera and radar modules as well as LiDAR and entertainment systems, optoelectronics-use HDI for tablets, and memory module boards for use at datacenters.
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New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Chemical Connection: Experience and Wisdom Gained by Doing Business
09/03/2025 | Don Ball -- Column: The Chemical ConnectionA well-managed company learns to adjust its strategies and processes based on what it learns during challenging times. The experience gained from making (or losing) a difficult sale is invaluable in adapting new sales and manufacturing processes necessary to make that sale the next time, no matter how painful those new processes might be.
Materials and Manufacturing for the AI Era: The Next PCB Frontier
08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamAI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards, expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.