-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Indubond to Feature Innovative Multilayer Press Technology at productronica 2019
November 5, 2019 | IndubondEstimated reading time: 1 minute
Indubond will be featuring new technology for the manufacture of PCBs at productronica 2019 in Munich. The company is set to present a multilayer lamination press: the InduBond X-Press and a compact bonding station: the InduBond X1.
The InduBond X-Press family is a revolutionary concept in multilayer press technology that has been developed utilizing electromagnetic energy to heat the existing stainless-steel separator plates with a never-before conceived accuracy and precision. The heating and cooling systems embedded within a robust hydraulic press inside a vacuum chamber design are controlled using a temperature feedback loop that guarantees perfect fidelity between the press recipe and the press result. This unique, electromagnetic induction technology helps make engineer’s desires become reality. All this while realizing an energy consumption savings in excess of 80% compared to traditional systems.
Features and benefits of the X-Press multilayer press include:
- Saves time and energy
- Maintains +/- 1 degree control over temperature for every multilayer
- Ramp-up temperature rates of up to 20°C/minute and more
- Cool-down temperature rates of between 0.5 and 5°C/minute
- Applies up to 60 bar of pressure and more
- Applies temperatures of up to 450°C and more
- Applies vacuum of less than 10 mbar and less
- Can process between 1 and 50 multilayer panels at once
Suggested Items
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.
Real Time with… IPC APEX EXPO 2024: Direct Imaging Equipment and Quad-wave DLP Light Engine Technology
05/03/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and MivaTek's Brendan Hogan delve into the company's innovative technologies, including direct imaging equipment and quad-wave DLP light engine technology. They highlight the benefits of direct imaging, compensation, and DART technology.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.