-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MIRTEC Europe Wins Best of Industry Award
November 11, 2019 | Mirtec EuropeEstimated reading time: 2 minutes
MIRTEC, “The Global Leader in Inspection Technology,” has won an EM Best of Industry Award in the category of Automated Optical Inspection for its MV-6e OMNI. The award was presented to Bentec distributor Accurex Solutions during a ceremony on 26 September at the Stellar Gymkhana in India. Bentec is MIRTEC’s managing partner for UK/Ireland and India.
“We are honored to have won a 2019 Best of Industry award from Electronics Maker,” said David Bennett, managing director of Bentec Ltd. “Earning more than 40 industry awards for our technologically advanced inspection solutions lets us know that we are on the right path to providing our customers with the best quality products and services available today.”
MIRTEC’s industry acclaimed MV-6e OMNI 3D AOI machines are configured with the company’s exclusive OMNI-VISION® 3D inspection system, which combines 15 megapixel CoaXPress camera technology with MIRTEC’s revolutionary digital tri-frequency Moiré 3D system. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured, the MV-6 OMNI systems feature four 18 megapixel side-view cameras in addition to the 15 megapixel CoaXPress top-down camera as well as an eight-phase lighting system to provide precision inspection of SMT devices on finished PCB assemblies.
The EM Best of Industry awards program started in 2015 and is organised by India’s leading electronics magazine, Electronics Maker. The award honors leading performers in the industry that drive the industry forward, providing them with a platform to showcase their achievements and product successes. This will help in furthering the growth of the electronics industry, challenging technology to reach the next level.
About MIRTEC
MIRTEC is a leading global supplier of automated optical inspection systems to the electronics manufacturing industry. For further information, visit www.mirtec.com.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.