Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
Averatek Releases New High-Density Process Details at IPC APEX EXPO 2020
January 17, 2020 | AveratekEstimated reading time: 1 minute
Averatek Incorporated has announced their participation in this year’s IPC APEX EXPO Conference and Exposition being held February 4th − 6th, at the San Diego Convention Center. Averatek will be presenting advanced PCB manufacturing technology as well as sharing expertise and experience in its deployment.
Averatek will first present on Tuesday, February 4th, at the technical conference followed by participation in a panel discussion at the Sessions at the Intersection. This discussion will be open to all attendees. On Wednesday, February 5th, Averatek will present at the inaugural community of interest meeting focused on additive PCB processes capable of feature sizes of 25 microns and below, exploring both the needs of next generation electronics and the needs of PCB fabricators licensing this technology.
“The electronics industry is at an inflection point.” said Haris Basit, CEO of Averatek, “Increasingly complex electronics continue to challenge traditional fabrication processes. Averatek’s A-SAP™ process resets the technology curve and opens up design opportunities that were previously unavailable.”
“We are excited to participate in this year’s IPC APEX EXPO. There is a lot to learn when working with a new, emerging technology. This IPC conference provides the opportunity to meet with, listen to and educate OEM’s, PCB Fabricators, and EMS companies all in one location. We have just scratched the surface on the ways A-SAP™ can be utilized in design and we are looking forward to insightful discussion and feedback”, said Mike Vinson, President and COO of Averatek.
Averatek’s A-SAP™ is an advanced manufacturing process for printed circuit board fabrication with trace and space as narrow as 15 microns. This process can dramatically reduce the space and weight of electronics systems, provide significant RF benefits and can be easily integrated with today’s traditional PCB manufacturing processes and materials.
About Averatek
Averatek Corporation develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging and RF and millimeter wave passive components. In addition, Averatek develops and sells the key chemistry that enables these advanced manufacturing processes. For more information visit www.averatek.com
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Ynvisible Celebrates Inauguration of New Production Facility in Norrköping, Sweden
09/09/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper display technology and printed electronics, is pleased to announce the successful inauguration of its new roll-to-roll production facility in Norrköping, Sweden – a city globally recognized as a center of excellence for Printed and Organic Electronics.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.
Safran, PGZ Reinforce Defense Partnership Through Innovation and Local Industrial Cooperation
09/08/2025 | SafranSafran Electronics & Defense, a leading European high-technology company in aerospace and defense, and Polska Grupa Zbrojeniowa S.A. (PGZ), Poland’s primary defense industry leader, have signed two Memorandums of Understanding (MoU) to further expand their collaboration in support of European security and industrial cooperation during the International Defense Industry Exhibition (MSPO) held in Kielce.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.