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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Meet John Watson, I-Connect007 Columnist
January 21, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Meet John Watson, CID, one of our newest I-Connect007 columnists! John’s columns will cover a variety of tips that designers need to know.
John Watson has been in the electronics industry for 40 years, with 20 of them being in PCB design. His career started in the U.S. Army in the early ‘80s, where he worked as an electronics technician on top-secret military systems. In the early ‘90s, the electronics industry changed how repairs were done, going from a component level to board level. With that, John re-invented himself, moving into the PCB design field.
Now, John is the senior PCB engineer for Legrand Corporation, where he leads 60 designers who are spread across the United States and Asia. John’s career also includes being a consultant to some of the top electronics companies in the world, emphasizing the PCB design process and data management. In addition, he is a highly sought-out writer, mentor, and speaker.
Read "Elementary, Mr. Watson" in the Design007 Week Newsletter. Subscribe today!
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