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ASC International Showcases 3D AOI/SPI Innovations at IPC APEX EXPO 2020
January 31, 2020 | ASC InternationalEstimated reading time: 1 minute
ASC International, a leading global manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the IPC APEX EXPO, Booth 1537, on February 4-6, 2020 at the San Diego Convention Center, San Diego, CA.
ASC International will provide live demonstrations of their industry leading SPI and AOI solutions. Product innovations will be highlighted by the LineMaster Fusion 3D offering the industry’s most cost effective inline 3D SPI solution. LineMaster DM is ASC’s top seller providing offline 3D SPI and AOI as a combination package - all wrapped up into a price point similar to single technology platforms. VisionPro AV862 provides a value packed AOI solution with all of the features needed for accurate and reliable defect detection. VisionPro M500 offering the industry’s standard for comprehensive true 3D bench top SPI.
“After 20 year of participation in the IPC APEX Expo shows, we are very proud and excited to kick off our new product release for 2020 in San Diego” stated Steve Arneson, National Business Manager. “ASC continues to advance our mainline products and the recent release of our LineMaster Fusion 3D is just another important addition to our product offering showing our commitment to our customer’s requests for accurate, reliable and affordable inspection solutions.”
The VisionPro and LineMaster series of inspection systems incorporate the most advanced, rapid 3D/2D sensor technologies coupled with a feature-rich, intuitive graphical user interface all packaged in a rugged, bench-top or stand-alone platform.
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10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
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