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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Meet Eran Navick, I-Connect007 Columnist
January 31, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Meet Eran Navick, one of I-Connect007’s newest columnists! In his columns, Eran will discuss technology around the world, touching on all aspects of PCB technology, especially high technology.
Eran Navick has been in the PCB business for over 25 years and held key positions in PCB companies, including as a PCB designer and applications engineer. During his career, he has worked with PCB companies all around the world and has a very strong knowledge of PCB technologies globally. He is currently the CEO of FineLine USA with responsibilities for all of Fineline Global’s North American operations.
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