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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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IPC APEX EXPO 2020: STEM Student Outreach Program a Success
February 6, 2020 | I-Connect007Estimated reading time: Less than a minute
Nine groups of STEM students from the San Diego, California, area spent their day at the San Diego Convention center to attend the IPC APEX EXPO 2020 exhibition. Two hundred students were immersed in the world of electronics industry manufacturing and assembly.
During one event planned for them, the students had a chance to participate in a hands-on soldering track creating wearable buttons to take home with them.
Students toured the IPC APEX EXPO show floor, where they rotated through various education tracks, receiving real-world technical skills training in soldering, coding, design, and assembly of PCBs. They also enjoyed a career panel during lunch and a presentation by Dr. John Mitchell, IPC president and CEO. This event is organized by the IPC Education Foundation.
Participating groups this year included Mission Hills High School, Morse High School, North County Trade Tech High School, San Marcos High School, E3 Civic High School, Point Loma High School, Otay High School, Mount Miguel High School, and the Girls in STEM Group.
Sponsors of the outreach event this year include I-Connect007, Nordson, Panasonic, TTM Technologies, and Weller.
RELATED VIDEO: Hear from a representative of the IPC Education Foundation.
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01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.
SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions
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Technica USA and Renex Reach Agreement to Distibute REECO Brand of Products
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AIM to Participate in SMTA Ultra High Density Interconnect Symposium
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Upcoming SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.