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Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
October 14, 2025 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
Héctor Hernández, Regional Sales Manager for Koh Young America, will deliver a technical session titled “The Power of Data: Maximize Productivity with Smart Factory Insights.” Based in Guadalajara, Héctor oversees Koh Young’s operations across Baja, Sonora, Durango, Chihuahua, and Jalisco. With more than a decade of experience helping electronics manufacturers enhance process capability and product quality, he brings a practical understanding of how inspection data and analytics can transform production efficiency.
His presentation explores how manufacturers can harness data to improve productivity, traceability, and quality across the SMT line. The session outlines a stepwise approach to turning raw inspection data into actionable insight. Starting with accurate 3D measurement and inspection results, Héctor will explain how to extract and interpret key metrics such as First Pass Yield (FPY), Defects Per Million Opportunities (DPMO), and Process Capability Index (CPK). He will then demonstrate how AI-driven platforms like KSMART and KPO (Koh Young Process Optimizer) use these metrics to automate programming, perform design of experiments (DOE), and optimize both printing and placement processes.
“When data is captured correctly and used intelligently, it becomes a powerful tool for driving improvement,” said Héctor Hernández. “By connecting inspection and process optimization, manufacturers can reduce variation, improve yields, and make better decisions in real time. That’s what smart factory transformation is really about.”
The presentation will also highlight how Smart Review, Koh Young’s AI-powered analysis tool, minimizes false calls and improves defect classification by learning from historical data and user judgments. Attendees will leave the session with clear strategies to:
- Enable closed-loop optimization across printing, placement, and inspection
- Implement AI-assisted decision-making to reduce human error
- Establish connectivity through IPC-CFX and SECS/GEM standards
- Drive continuous improvement in real time across SMT operations
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11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
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New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.