Toray Achieves World's First UHF Wireless Communication
February 11, 2020 | Toray IndustriesEstimated reading time: 2 minutes
Toray Industries Inc announced that it has become the first in the world to communicate wirelessly across the UHF (ultrahigh frequency) band (see note 1) with a printed semiconductor. This setup employs a printed radio-frequency identifier (RFID) (note 2) that the company created. The RFID employs a high-performance semi-conductive carbon nanotube composite (note 3).
Toray's achievement demonstrated the potential for manufacturing UHF RFIDs by low-cost printing processes to dramatically streamline retail and logistics operations. Examples include automating cash registers and efficient inventory management. The company will accelerate development to commercialize printed RFIDs. RFID should greatly enhance work efficiency in retailing and logistics because it offers long-distance communication, batch reading, and other benefits. However, conventional silicon RFID tags have not become widespread because of their cost existing integrated circuit (IC) chips (note 4) that are expensive, as they are made with complex processes employing high temperatures and vacuum environment. IC chip mounting processes are also needed. This situation drove efforts to manufacture low-cost ICs and mounting process-free printed semiconductors, such as organic semiconductors.
The challenges over many years, however, have been a mobility of just 20 cm2/Vs which is far from application to UHF RFIDs. Toray has engaged in R&D on RFIDs with printed materials, focusing on high-performance carbon nanotube composites. The semiconductor announced today delivers a mobility of 182 cm2/Vs—a new world record. While thin film transistors (TFTs) are either p-type (positively charged) or n-type (negatively charged), carbon nanotubes are normally p-type. Toray employed proprietary material technology to develop an n-type feature, realizing both p- and n-type TFTs that would be necessary to form power-saving, low-cost ICs. For more information see the IDTechEx report on RFID Forecasts, Players and Opportunities 2019-2029.
The company fabricated an RFID prototype incorporating a 24-bit memory with a low-cost printing technology by adopting this new material and proprietary device and process technologies. It was thereby able to communicate wirelessly with UHF waves across a distance of 20 cm, becoming the first in the world as a printed UHF RFID. Toray's product goal is to materialize a 60-bit memory. By popularizing its new low-cost coated RFIDs in retailing and logistics, it will be able to promote product data collection and sharing, dramatically enhancing overall supply chain efficiency.
The company will endeavor to improve communication performance, including communication distance, while developing on-film manufacturing technologies, in driving to commercialize printed RFIDs. Toray's research in this area was supported in part by "Low Carbon Technology Research and Development Program" of Japan's Ministry of the Environment. Toray will combine its core polymer chemistry and nanotechnology to early establish printed RFID technology and thereby contribute streamline operations in the retailing and logistics fields, which is suffering from severe labor shortages. The company will endeavor to develop cutting-edge materials that can change our lives in keeping with its commitment, "contributing to society through the creation of new value with innovative ideas, technologies and products."
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in