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Electronics Industry Elevates its Excellence at IPC APEX EXPO 2020
March 2, 2020 | IPCEstimated reading time: 2 minutes
From factory of the future advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO 2020 provided the education and networking connections that helped 8,516 visitors (attendee and exhibitor personnel) from 61 countries address today’s business challenges and prepare for the future.
This year’s 477 exhibitors showcased cutting-edge products and services on 149,900 net square feet of exhibit floor space. And with more than 80 percent of the 4,211 attendees identifying themselves as key buyers or influencers, the exhibitors at North America's largest electronics assembly event enjoyed three days of qualified leads, business development and brisk sales.
In keeping with the event’s theme, “Elevate the Excellence of Electronics,” APEX EXPO 2020 featured more than 75 technical papers detailing original research and innovations from industry experts around the world. Attendees had access to new research on materials and processes and opportunities to learn more about trending materials, applications and processes such as PCB fabrication, assembly processes and Industry 4.0 (including a live demonstration on the exhibit floor showing how two industry standards work together).
IPC APEX EXPO’s full- and half-day professional development courses blended traditional electronics industry topics with hot-new developments, delivered by corporate technologists, consultants, training center staff and university faculty. Attendees choose from an array of leading topics such as: PCB fabrication troubleshooting, supply chain management, high-speed applications, surface reliability, semiconductor packaging technologies and design for excellence (DFX).
Many attendees achieved what they sought at the event. “At APEX EXPO, I was able to evaluate all selective solder and placement machines in one place, with all of the relevant technical resources on hand to answer my questions. This was a great use of my time,” said Larry Davis, production engineer, Hach.
Rodney Doss, ESD program manager at Samtec, Inc. added, “Networking at the committee meetings brought me together with individuals who share similar challenges at their facilities. This is a great way to learn how others throughout the world tackle manufacturing issues. I now have new resources to get expert opinions on ideas I may have in the future.”
“When I spoke with exhibitors and attendees at this year’s show, feedback was positive. Attendees said that networking and educational events and activities helped them find new ways to solve challenges; the exhibition provided them the opportunity to meet suppliers that could help them save time and money, and foster new business opportunities,” said John Mitchell IPC president and CEO. “Our team is already working on putting together next year’s show, and I look forward to our industry’s continued support in making IPC APEX EXPO 2021 a success.”
In 2021, IPC APEX EXPO will return to the San Diego Convention Center, January 23-28. Industry researchers, engineers and academics are invited to submit an abstract for consideration in next year’s technical conference or professional development courses in the online Call for Participation at www.ipcapexexpo.org/education/call-for-participation.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.