Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
ESA Approval for Ventec VT-901 Material in ACB Belgium Rigid & Flex-Rigid Production
May 26, 2020 | Ventec International Group Co., Ltd.Estimated reading time: 2 minutes
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully qualified by ESA in ACB Belgium’s manufacturing process for rigid and rigid-flex polyimide PCBs and HDI PCBs.
With high Td (395oC), a Tg of 250oC and Low-Axis CTE (50), Ventec's VT-901 polyimide material provides the extremely high reliability performance demanded by ACB’s flex & flex-rigid and HDI PCB manufacturing process that meets ESA requirements.
Ventec manufactures all VT-901 polyimide using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. The same specialist equipment is used for the production of thin-core laminates for use in the most demanding space and aerospace PCB applications. ACB's state-of-the-art PCB manufacturing facility in Dendermonde (Belgium) and the AS9100 Rev D accreditation of Ventec's manufacturing and distribution facilities, position both companies as market-leaders within the space and aerospace electronics supply chain.
Joachim Verhegge, ACB’s Product Engineering Manager, says: 'Meeting and exceeding the highest possible standards of quality and performance is our highest priority. We are pleased to receive ESA approval for the use of Ventec's material in our designs and look forward to continuing to work closely with ESA in meeting their requirements.'
Mark Goodwin, Ventec COO EMEA & USA, commented: ‘I'm delighted with our long-term technology partnership with ACB, assisting them through close cooperation to further strengthen their position for aerospace-standard solutions and finished PCBs. The ESA approval demonstrates the thermal robustness of Ventec VT-901 polyimide and its suitability for use in high reliability rigid and flex rigid multi-layers in the demanding aerospace sector.'
Ventec International is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
For more information, visit www.venteclaminates.com.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.