-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Zuken Announces E3.series 2020 For Wire Harness and Cabinet Design
July 16, 2020 | ZukenEstimated reading time: 2 minutes

Zuken announces the 2020 release of its E3.series electrical and fluid engineering tool suite featuring expanded functionality across the complete range of applications from schematics and cable planning through to 2D and 3D cabinet and wire harness design and documentation. E3.series is widely used in the manufacturing industry to design large, complex electrical cabling, control cabinet, and wire harness designs for advanced applications in the machinery, power, automotive, transportation, and aerospace and defense industries.
In addition to numerous ease-of-use productivity improvements, E3.series 2020 features significant enhancements in the areas of tabular editing, the embedding of office documents, 3D cabinet layout, and 3D PDF support.
- General usability enhancements: Users will benefit from improved productivity from GUI enhancements that include new technology and icons offering a range of short-cuts. Office documents can now be embedded leveraging the Windows OLE protocol and permanent properties windows provide full component information with a simple click.
- Extended tabular search, filtering, and editing: Previously separated search operations are now combined into one single Boolean search function covering multiple device lists, sheets, and connection lists. Users can now search, modify, and update large schematic and wiring plans without navigating through numerous sheets.
- 3D cabinet layout: Dynamic contours can now be defined in the project with move and copy/paste commands, and viewed in the cabinet design tree. The component placement functionality supports multiple component placement directions speeding design activities. The complete cabinet design can now be viewed in a fully interactive 3D PDF; a new output option.
"With the digitization and networking of engineering and manufacturing processes in the manufacturing industry, electrical and fluid engineering is emerging from a specialist activity to become part of an end-to-end engineering workflow," says Joachim Frank, Managing Director of Zuken E3 GmbH. "Through the combination of powerful electrical engineering capabilities and cabinet layout functionality, we are providing a solution that combines advanced electrical and mechanical engineering capabilities for the specific needs of electrical engineers."
E3.series delivers a concurrent electrical engineering environment supporting advanced requirements for electrical planning and documentation, cabinet and wire harness design, and manufacturing outputs. Its object-oriented architecture provides the user with a unified design representation across multiple views delivering consistent design information to help eliminate errors, improve quality, and reduce design time.
Partner in the Smart Cabinet Building Initiative
Zuken's E3.series has been selected to provide the engineering backbone for the recently launched Smart Cabinet Building Initiative. The initiative is comprised of a multi-company cooperation that includes Weidmüller, Komax, Armbruster, and Zuken. The goal of Smart Cabinet Building is to offer integrated solutions for today's challenges in the field of control cabinet engineering and manufacturing. The base for networking today's disconnected process steps is the "digital twin," a complete digital description of the electrical panel and its components created in Zuken's E3.series.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
GlobalLogic, Ericsson Deploy Private 5G Network at Hitachi Rail’s State-of-the-Art Digital Factory
09/11/2025 | BUSINESS WIREGlobalLogic Inc., a Hitachi Group company and leader in digital engineering, has designed and deployed a state-of-the-art 5G private network at Hitachi Rail’s most digitally advanced facility in Hagerstown, Maryland, USA.