AEM Elevates Capabilities in Automation Fixtures by Acquiring DB Design
July 23, 2020 | AEM Holdings Ltd.Estimated reading time: 1 minute
AEM Holdings Ltd, a global leader offering application specific-intelligent system test and handling solutions for semiconductor and electronics companies serving advanced computing, 5G, and AI markets, announced that it has acquired 100% stake in California-based DB Design Group, Inc.
DB Design is a world-renowned supplier of automation fixtures, device kits, and other test-related products. It has over 30 years of experience in delivering turnkey solutions for virtually all major semiconductor test and handling systems. DB Design has a key team of designers and machinists located in California serving the Silicon Valley customer base.
The acquisition of DB Design provides AEM with several synergies, including: [a] DB Design’s specialized capabilities expands AEM’s Serviceable Available Market to include the automation fixture and device kit markets. [b] DB Design’s customer base presents a synergistic growth opportunity for AEM. Page 2 of 2 AEM Holdings Ltd 52 Serangoon North Ave 4 Singapore 555853 AEM intends to leverage on DB Design’s capabilities to expand its product offerings and customer portfolio in the semiconductor and electronics spaces.
AEM’s Executive Chairman Loke Wai San commented, “We are thrilled that the team at DB Design is now part of our AEM family. Not only does DB Design have an impressive list of semiconductor customers for their lab handler and custom kits, they also bring tremendous design and application engineering capabilities for AEM’s consumables business, and local support to our North American based customers. We are now able to offer almost 24-hour R&D services to our customers leveraging our US and Asia based teams, as well as rapid prototyping and supply chain resiliency via high mix production run support in the U.S.”
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.