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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

09/25/2026 | Cadence Design Systems
Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance

09/02/2026 | Cadence Design Systems
Cadence announced that its PHY and controller IP for the PCI Express® (PCIe®) 6.0 specification, implemented in the TSMC N3 process, achieved first-pass success at the recent PCI-SIG® compliance workshop held in late July.

Cadence Reports Q2 2026 Financial Results

07/28/2026 | Cadence Design Systems
Revenue of $1.584 billion, compared to revenue of $1.275 billion in Q2 2025.

Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

07/20/2026 | Cadence Design Systems
Rapidus Corporation and Cadence announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads).
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