Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
The Marketing Minute: Marketing With Layers
IPC APEX EXPO 2021 Goes Virtual
December 8, 2020 | IPCEstimated reading time: 1 minute
IPC APEX EXPO 2021 will be offered virtually, March 8-12, 2021.
“Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said IPC President and CEO John Mitchell. “The event will now take place in a safe, all-virtual format.”
While the event is going virtual, IPC APEX EXPO will still be the place to connect, collaborate and learn as the event’s virtual platform will allow attendees, exhibitors and speakers to easily navigate more than 100 technical conference sessions and professional development courses as well as product demonstrations, and schedule one-on-one meetings with exhibitors. As an added bonus, technical conference sessions will be available to registered attendees for replay, providing a unique opportunity to take advantage of education for 90 days after the event.
And rounding out the immersive experience, attendees can attend multiple keynotes, a “meet and greet” with IPC Hall of Famers and Emerging Engineers, participate in a virtual trivia event, and learn about cutting edge products and technologies during daily exhibitor new product introductions.
Mitchell added, “Be it in person or via an online platform, it is IPC’s goal to maintain IPC APEX EXPO’s position as the premier event for the electronics manufacturing industry, providing practical applications for learning – knowledge that attendees can immediately apply to their work and as well as far-reaching insights that can be applied toward implementing future technologies. Wherever in the world you may be located, IPC APEX EXPO 2021 is the place to be.”
Registration for IPC APEX EXPO 2021 is expected to open December 17. To view schedule at a glance and exhibitor list, visit www.ipcapexexpo.org. IPC APEX EXPO will return to an in-person format in 2022 and will take place January 25–27, 2022 at the San Diego Convention Center.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.