-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
NovaCentrix to Show PulseForge Soldering Batch, In-Line Solutions at IPC APEX EXPO
February 10, 2021 | NovaCentrixEstimated reading time: 1 minute
NovaCentrix, the industry’s leading provider of photonic curing tools, conductive inks and the new PulseForge® Soldering high-intensity pulsed-light solution, is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The NovaCentrix team will showcase PulseForge Soldering Batch and In-Line solutions.
PulseForge® Soldering Batch is ideal for stand-alone processing requirements. Ultra-fast heating and cooling means no damage to heat-sensitive substrates and components. And the freedom to use less expensive materials, including processing with off-the-shelf SC305, with both Batch and In-Line models.
PulseForge® Soldering In-Line is SMEMA 9851 compliant with high throughput, and available with input and output buffers. Move past conventional, slow, inflexible soldering solutions and take back control of materials and design in electronics manufacturing – without damaging temperature-sensitive substrates and components.
NovaCentrix’ PulseForge® soldering tools enable new types of products in applications like consumer electronics, automotive, and medical wearables. Product innovators and manufacturers can utilize flexible, low-cost substrates and deliver functionality not possible with conventional soldering. PulseForge Soldering’s ultra-fast, high-intensity pulsed-light solution processes in seconds or less. And with no damage from sustained heat, common with other soldering solutions, there is no damage to heat-sensitive substrates, such as paper and plastic, or components, including LEDs.
NovaCentrix has partnered with customers for 20 years in taking products from inception to full production. PulseForge® photonic curing tools have been adopted world-wide and continue to revolutionize the printed electronics industry. Additionally, NovaCentrix’ Metalon® conductive inks capitalize on advanced materials and formulations to provide conductivity options for additive manufacturing of printed electronics with stretchable, solderable, resistive and magnetic qualities.
For more information about MaRC Technologies’ products and services, visit www.marctechnologies.com.
To learn more about NovaCentrix products and innovations, please visit www.NovaCentrix.com.
About NovaCentrix
NovaCentrix partners with you to take products from inspiration to implementation. Through our innovative PulseForge® tools and Metalon® Inks, we continue to enable advancements in printed electronics for researchers, product innovators, and manufacturers as technologies and markets evolve.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.