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Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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DownStream Focused on Rigid-Flex and Embedded Component Support
March 16, 2021 | Real Time with...IPCEstimated reading time: Less than a minute

Editor Kelly Dack and Joe Clark, co-founder of DownStream Technologies, discuss trends in PCB design and how this has led to the company's introduction of rigid-flex design support for their tools.
We invite you to visit Real Time with...IPC APEX EXPO 2021 for all the interviews produced by I-Connect007 in partnership with the IPC. Video and audio content is available now at realtimewith.com.
Later this month, watch for Real Time with...IPC APEX EXPO 2021 Show & Tell 2021, our celebrated special annual post-show magazine. We compile and highlight all of our show-related content and deliver it to current my I-Connect007 registrants.
To listen to this Real Time with… IPC APEX EXPO interview, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
08/19/2025 | Happy Holden -- Column: Happy’s Tech TalkWith the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.