SIA Urges Prompt Action to Enact Bold Investments in Domestic Semiconductor Manufacturing, Research
April 29, 2021 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) has released the following statement from President and CEO John Neuffer regarding President Biden’s first address to a joint session of Congress.
“During tonight’s address to Congress and throughout his first 100 days in office, President Biden has demonstrated a commitment to strengthening America’s leadership in semiconductors through robust investment in domestic chip manufacturing, design, and research. The President and a large, bipartisan group of leaders in Congress understand semiconductors are at the heart of our economic strength, national security, digital infrastructure, and global competitiveness, and we appreciate their support and leadership.
“The President’s recent call for $50 billion to fund the semiconductor manufacturing and research provisions in the CHIPS for America Act is bold and necessary if the U.S. is to remain globally competitive and lead in the technologies of tomorrow. Now is the time for leaders in Washington to shoulder in by enacting legislation that funds these important provisions, which will ensure more of the chips our country needs are produced on U.S. shores.”
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.