-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AT&S Chooses Malaysia for its First Production Site in Southeast Asia
June 10, 2021 | AT&SEstimated reading time: 2 minutes
AT&S, the Austria-headquartered global manufacturing leader of high-end printed circuit boards (PCB) and integrated circuit (IC) substrates, has chosen Malaysia as its first production plant in Southeast Asia. Andreas Gerstenmayer, Chief Executive Officer (CEO) of AT&S met with YAB Tan Sri Muhyiddin Yassin, the Prime Minister of Malaysia, yesterday during a video conference to convey the official announcement.
AT&S’ new campus in Kulim Hi-Tech Park, Kedah, to produce high-end PCBs and IC substrates involves a proposed total investment of RM8.5 billion (€1.7 billion) and will create 5,000 high-tech and high impact jobs. The construction of the facility is scheduled to begin in the second half of 2021 with commercial operations targeted to come on stream in 2024.
In explaining the choice for the strategic decision, AT&S CEO Andreas Gerstenmayer said, “After very intensive location scouting globally, Malaysia has emerged as the country in which we want to push ahead with our ‘More than AT&S’ strategy. AT&S brings the latest generation of high-end technologies to the country and builds up a completely new technology sector. Besides manufacturing of high-tech products, a significant amount of R&D activities will be executed at this new location. Malaysia can benefit its position as a technology-country and can strengthen the region as a hightech manufacturing hub in Asia.” Pointing out the perfect win-win-situation, AT&S COO Ingolf Schröder said, “The location in the Kulim Hi-Tech Park, Kedah is a perfect match to our expansion plans. Beside the excellent infrastructure and stable supply chain, the whole ecosystem has been aligned in the last decades, the semiconductor industry has been in Malaysia for more than 30 years and the overall environment is very well developed.”
Welcoming AT&S into Malaysia’s vibrant electrical and electronics (E&E) ecosystem, the Prime Minister YAB Tan Sri Muhyiddin Yassin said, “AT&S’ decision to invest here speaks volumes of its confidence in the Malaysian economy’s capacity and promise of sustainable growth.” He expressed confidence that Malaysia’s E&E industry’s skilled talent pool, facilitative investment environment, as well as deep integration with international supply chains, offer the ideal mix for high-tech stakeholders. “Working hand in hand, AT&S’ footprint in Malaysia will also further boost the development of our semiconductor ecosystem, enable opportunities for our local vendors in the field of advanced electronics and spur high-tech employment for Malaysians,” the Prime Minister added.
The Prime Minister congratulated AT&S on the significant step into Malaysia and added: “We are delighted that AT&S has committed to Malaysia as we have been working closely with the company since November last year to make the project possible. This investment announcement is an important milestone for Malaysia, demonstrating that our efforts in attracting high quality international companies are bearing fruit.”
Suggested Items
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
North American PCB Industry Sales Down 23.8% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.