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NextFlex Convenes the Hybrid Electronics Community at Binghamton University

05/01/2024 | NextFlex
Binghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking. 

New Appointment Strengthens Ventec’s Value-Added Equipment Division

04/29/2024 | Ventec
Ventec announces the appointment of Leigh Allinson as Commercial Director for its value-added PCB Equipment division 'Ventec Giga Solutions'.

Aaron Woolf, Dylan Peterson Join SIA Team

04/22/2024 | SIA
The Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

Fineline Global Group Acquires IBR

04/19/2024 | PRNewswire
IBR Leiterplatten GmbH & Co. KG joins the Fineline Global Group and is now an integral part of one of the leading suppliers of PCBs. Fine Line Gesellschaft für Leiterplattentechnik mbH acquired 100% shares of IBR.

Cicor Shareholders Approve All Proposals

04/19/2024 | Cicor Technologies Ltd.
At the Annual General Meeting of Cicor Technologies Ltd. in Zurich, the shareholders approved all proposals.
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