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Flexible Circuits Uses Essemtec FOX2 for High-Rel Flex-Centric Electronic Interconnect Assemblies
August 12, 2021 | EssemtecEstimated reading time: Less than a minute

Flexible Circuits, Inc. (FCI), a leading supplier of the highest reliability and complex flex-centric electronic interconnect assemblies to the U.S. defense and aerospace markets, purchased a FOX2 multi-function combined pick-and-place and dispensing system. Essemtec’s FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Through concurrent engineering, comprehensive quality assurance and process expertise, FCI’s dedicated employees develop lasting cooperative relationships to meet the stringent demands of its valued customers. Joe Karcewski, Flexible Circuits Assembly Manager commented, “We have very demanding and specific process requirements and we found the flexibilty and the scalability of the Essemtec Fox to best fit our current and future needs.”
As a manufacturer of flexible circuits and assemblies since 1963, FCI has a unique position within the industry. The company occupies 55,000 sq. ft. of air-conditioned building in a pleasant industrial park directly adjacent to private homes. The company has been nominated multiple times for the Governors award, which rewards industries that have a demonstrated record of environmental activism.
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Julia McCaffrey - NCAB GroupSuggested Items
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08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.