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SIA Statement on Senate Commerce Committee Legislation that Funds CHIPS & Science Programs

05/02/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from Vice President of Government Affairs David Isaacs in support of provisions included in legislation pending before the Senate Commerce Committee that would fund critical CHIPS & Science Act programs.

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho

04/29/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.

Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

04/25/2024 | PRNewswire
Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.

SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce

04/18/2024 | SEMI
The SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.
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