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Report: Broadcom Scraps $1 Billion Chip Investment in Spain

07/15/2025 | I-Connect007 Editorial Team
American chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.

Siemens Collaborates with SK keyfoundry to Launch 130nm Automotive Power Semiconductor Calibre PERC PDK

07/15/2025 | Siemens
Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) that is exclusively designed for use in Calibre® PERC™ software.

Natcast Celebrates Grand Opening of NSTC EUV Accelerator at NY CREATES’ Albany NanoTech Complex

07/15/2025 | Natcast
Natcast, the purpose-built, non-profit entity designated by the Department of Commerce to operate the National Semiconductor Technology Center (NSTC) established by the CHIPS and Science Act, celebrated the grand opening of the CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), with an official ribbon-cutting ceremony at the NY CREATES Albany NanoTech Complex in Albany, N.Y., where the facility is located.

Materion Completes Acquisition to Expand Semiconductor Footprint and Capabilities in Asia

07/14/2025 | Materion
Materion reported that it has completed its previously announced acquisition of manufacturing assets for tantalum solutions in Dangjin City, South Korea, serving the semiconductor market.

STMicroelectronics, Metalenz Sign a New License Agreement to Accelerate Metasurface Optics Adoption

07/14/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement.
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