-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
PVA Receives Patent Optical Bonding Software in Korea
November 23, 2021 | PVAEstimated reading time: 1 minute
PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it has patented its optical bonding software in Korea. With the new patent, the software is patented throughout the US, United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain, and now Korea.
PVA's focus on these types of software and hardware tools demonstrate the company’s commitment to developing technology to reduce setup times and take the guesswork out of process and application development for the growing display bonding market. This software feature combined with PVA’s Fluid Flow Vision enables the rapid setup of a critical assembly step for new bonding processes.
The optical bonding software greatly simplifies the bonding process by providing a system that alleviates the guess-work of creating perfect bond sequences from scratch, resulting in less waste and faster time to production.
One of the most crucial and challenging steps in the optical bonding process is the final physical mating of the two substrates (e.g. glass to screen). With this patented feature, the user is able to have complete control over the sequence of events (speeds, distances, dwells, etc.) during this critical bonding step on an actual part in production. Using a single button and visual feedback on-screen, the user easily creates a live bond sequence while the machine is simultaneously learning and recording everything quietly in the background.
After the bond sequence has been completed, control is automatically handed back over to the machine to finish the rest of the bonding process. This “learned” bond sequence is then safely stored and can be easily recalled or modified for even more precise tuning.
Within the countless factors that go into making a perfect bond, this sequence must be highly controlled and finely tuned in order to not cause material leakage, trapped bubbles, or other defects that would result in a bad part. Leveraging this new functionality, users can now rapidly prototype and make production ready bond sequences with ease, providing speed and consistency to a once slow and complicated step in the optical bonding process.
PVA manufactures turnkey solutions that help its customers improve their competitiveness. This is accomplished through engineering robust processes that introduce repeatable results that reduce waste, increase throughput and lower manufacturing costs.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: