-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
LeeMAH Electronics Selects Juki’s G-Titan Screen Printer
December 1, 2021 | Juki Automation Systems (JAS), Inc.Estimated reading time: 1 minute

Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is pleased to announce that LeeMAH Electronics purchased a new G-Titan Screen Printer with auto dispensing. The system was installed at the LeeMAH Electronics Dallas, TX facility and the sale was facilitated by Scott Fillebrown, Principal at Southwest Systems Technology.
LeeMAH Electronics offers manufacturing and test solutions to OEMs with high-mix and low-medium volume needs. The company offers customer-focused strategies with its California and Texas locations that total more than 140,000 ft2.
The new G-Titan Screen Printer is equipped for I4.0, lights-out manufacturing and quality print control. Standard features include stencil inspection, solder paste rolling measurement, stencil flattener, support block crash prevention, and automatic solder paste dispense (500g jar).
The G-Titan features SPI closed-loop communication. The smart SPI closed-loop function provides SPI detection information to the printer to auto adjust and offset printing conditions. This is currently compatible with major SPI manufacturers.
The automated solder paste dispensing reduces production costs by reducing production personnel, dispensing the paste directly from the jar. It extends the solder paste viscosity and maximizes the solder paste lifespan. Additionally, exposure to air is reduced, minimizing issues from improper storage. This also reduces human errors and the chance of mixing old and new solder pastes together.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.