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Segment 11 of Koh Young Micro Webinar Series: Connectivity Using CFX and Hermes
December 8, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Watch & Learn! I-Connect007 has released segment 11 of "Converting Process Data Into Intelligence."
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
In under four minutes, episode 11 Connectivity Using CFX and Hermes teaches viewers about Machine-to-machine (M2M), the foundation that drives the smart factory vision, enabling automatic SMT line maintenance and management. The systems should be designed to work with the printer, mounter, conveyor, and other equipment types to simplify communication across the entire SMT line. Presenter Ivan Aduna shares how initiatives such as IPC-CFX, IPC-Hermes, and IPC-DPMX all help to pull the factory of the future into the present.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, this entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit Converting Process Data Into Intelligence and start watching, free, today!
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The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
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More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.