Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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IPC APEX EXPO 2022 Will Be In-person Event
December 20, 2021 | IPCEstimated reading time: Less than a minute
As IPC is adhering to California Department of Public Health Guidelines, proof of COVID vaccination or negative test is required to attend.
Attendees, exhibitors, speakers, instructors, staff, and all convention center contractors attending/working at IPC APEX EXPO 2022 will be required to present either proof of full vaccination or a negative COVID-19 test within one day for an antigen test and two days for a PCR test to enter the event. Masks are required for all, regardless of vaccination status.
For the most up-to-date information on attendance policies and procedures, visit www.ipcapexexpo.org/event-info/covid-19.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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