Siemens Joins Intel Foundry Services’ EDA Alliance Program
February 8, 2022 | SiemensEstimated reading time: 2 minutes
As a member of the Intel Foundry Services (IFS) Accelerator, EDA Alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and methodologies for Intel’s world-class processes.
Siemens Digital Industries Software today announced it has become a charter member of the Intel Foundry Services (IFS) Accelerator - EDA Alliance, a program committed to establishing an ecosystem for the design and fabrication of next generation System-on-Chip (SoCs) manufactured on IFS’ leading-edge process technologies.
The initiative promotes collaboration between IFS and its ecosystem partners, with a focus on reducing risk and tackling design barriers while accelerating time-to-market for mutual customers’ products. IFS Accelerator - EDA Alliance partners receive early access to Intel process and packaging technologies, allowing them to co-optimize and enhance tools and flows to best realize Intel’s technology capabilities.
“We are excited to announce the IFS Ecosystem Alliance as a major step forward for Intel's foundry ambitions,” said Rahul Goyal, vice president and general manager for Intel Product & Design Ecosystem Enablement. “We are pleased that Siemens EDA has joined the program. The combination of Siemens’ world-class EDA offerings and IFS' leading-edge process technologies will provide design teams across the industry with the solutions needed to deliver in today's competitive IC markets.”
As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and methodologies for Intel’s world-class processes. The initial Siemens EDA product lines certified by IFS include the industry-leading Calibre® nm platform, as well as the Analog FastSPICE (AFS) platform for leading-edge circuit verification targeting nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits.
“With the increasing importance of semiconductors in the global economy, Intel’s commitment to the foundry market through IFS is an important new source of innovative capacity for advanced products,” said Joe Sawicki, executive vice president, IC-EDA for Siemens Digital Industries Software. “Siemens is proud to collaborate with IFS to help provide software solutions that are tuned to allow mutual customers to get the most out of Intel process and packaging technologies.”
- The Printed Circuit Designer’s Guide to... Stackups: The Design within the Design by Bill Hargin (a free eBook available for download)
- The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing?by Sagi Reuven and Zac Elliott (a free eBook available for download)?
- The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age? by Oren Manor (a free eBook available for download)?
- The Printed Circuit Designer’s Guide to… PowerIntegrity by Example by Fadi Deek (a free eBook available for download)
- Siemens’ free, 12-part, on-demand webinar series?“Implementing Digital Twin Best Practices?From?Design Through Manufacturing.”?
- RealTime?With ...?Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing?
- You can also view other titles in our full I-007eBook library here
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.