-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Additive Design: Same Steps, Different Order
April 12, 2022 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.
Andy Shaughnessy: Dave, give us some background on Winonics and your focus on additive and semi-additive processes.
Dave Torp: Additive Circuits Technologies is the parent company, which owns two companies. One is Winonics, a rigid circuit board company. The other is a flexible circuit board company called Bench 2 Bench. Winonics is ISO-9001, AS 9100, and ITAR-registered. We have a 52,000 square-foot facility in Brea, California. Bench 2 Bench has a 25,000 square-foot facility, located about 10 minutes away in Fullerton.
From the holistic view, our focus is in the high-reliability electronics market. We focus on the aerospace, defense, and the medical device electronics. Our competitive anchor is providing great service. We don’t really put too many boundaries on what we do. Simply put, we’re a technology realization company.
We have process patents for applying circuitry and metallization in an additive technology. We also have some trade secrets that we keep behind the vest with respect to our manufacturing operations. What the additive technology enables is ultra-fine features and ultra-high definition. The enabling technology provides metallization in very high-density configurations to make high-density interconnects. We have demonstrated the technology down to 15-micron lines and spaces, which was, at the time, the limit of the laser technology that we had.
As the LDI technology becomes more precise, we’ll have the ability to go further down that pathway. So, we look to being capable of doing 8-micron lines and spaces and below by 2023.
The real drivers for the technology are miniaturization and the need for greater speed. If you look at some of the frequencies that are required to enable a communication, you are getting up into the 5G-plus mindset. The layer counts within the circuit boards aren’t increasing, but the number of interconnects between those layers is increasing. You can have a lot of fun with respect to the layers that are being interconnected and how the microvias are being stacked and racked upon each other. Sometimes you stack them right on top of each other. Other times, you stagger them out a little bit, depending on the signal integrity that you want.
With respect to the additive processes, first we have semi-additive technology, which is a fairly new process. In a lot of cases, you take the ultra-thin copper foils, or the plating applied to the substrate. You hit it with photo-sensitive materials, etch away that ultra-thin part of the copper, and then start to plate back up. That’s the semi-additive process.
The fully additive process is the newest technology, where you print the pattern that you want on the substrate without copper foil, using a palladium or platinum-based chemistry, and expose it with a laser or a UV source of radiation. Then you allow the electroless copper plating to be deposited, followed by electrolytic plating
This allows us to create ultra-fine traces down to sub-15-micron type technology. We’re excited about the opportunities, especially in the in-betweens, where you’re using hybrid interposer layers to try to connect this heterogeneous integrated package together.
To read this entire conversation, which appeared in the April 2022 issue of Design007 Magazine, click here.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.