Fresh PCB Concepts: The Importance of Bare Board Testing for Reliability
Elementary, Mr. Watson: Design Intent Over Design Speed
Beyond Design: Managing Linear Workflow Bottlenecks
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
July 28, 2025 | I-Connect007Estimated reading time: Less than a minute
The Optimize the InterconnectSM podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the InterconnectSM is gaining traction across the industry.
This engaging series explores how MKS’ ESI is redefining microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
In this new episode, “OTI: Why It Matters,” Ryder explores why industry leaders are adopting this unified approach to increase efficiency and reliability in design and manufacturing.
The podcast series is complemented by a newly released companion guide, which provides engineering teams with a technical deep dive into the unified via formation methodology, including case studies that highlight the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/19/2025 | Nolan Johnson, I-Connect007We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Final Episode of I-Connect007’s UHDI Podcast Series Now Available On Demand
12/17/2025 | I-Connect007I-Connect007 announces the release of the final episode of its podcast series, On the Line With… American Standard Circuits: UHDI. Episode 12, titled “UHDI? It Depends,” brings the series to a close with an engaging, FAQ-driven discussion addressing the PCB industry’s most common questions about ultra-high-density interconnect (UHDI) technology.
Why Reliability Matters More Than Ever—Ultra HDI Podcast Episode 9 Now Streaming
11/21/2025 | I-Connect007What does it take to design for ultimate reliability? Find out in Episode 9 of I-Connect007’s acclaimed podcast series, On the Line With… American Standard Circuits: Ultra HDI. In “High-Reliability Applications,” host Nolan Johnson and John Johnson of American Standard Circuits discuss how UHDI technology is enabling engineers to deliver stronger, more sustainable solutions in high-stakes industries.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/17/2025 | Marcy LaRont, I-Connect007Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.