-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Call For Papers For IPC APEX EXPO 2023
April 25, 2022 | IPCEstimated reading time: 2 minutes
The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2023 to be held at the San Diego Convention Center. The technical conference will take place January 24–26, 2023.
“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair are leading the group through process improvements with a focus to provide stronger technical content spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2023 technical conference has in store.”
Led by Stanton Rak, Ph.D., SF Rak Co. (Chair) and Udo Welzel, Ph.D., Robert Bosch GmbH (Co-Chair), the committee comprises the following members: Beverley Christian, Ph.D., HDP User Group; Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Eric Campbell, IBM; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Kelly Scanlon, IPC; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano; Milos Lazic, Indium Corporation; Paige Fiet, TTM Technologies, Inc.; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski-Campbell, IBM; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Laura Cohen, Ph.D., Continental Automotive; John Bauer, Collins Aerospace.
Technical conference paper and poster abstracts are due Monday, June 20, 2022. IPC seeks abstracts summarizing original and previously unpublished work describing significant results from research experiments, highlighting new techniques or materials, and/or discussing cutting-edge trends and challenges facing the electronics manufacturing industry.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
Global Turbine Asia Boosts Aerospace Growth and Talent Through Strategic Partnerships
04/21/2026 | ACN NewswireThe MoUs reflect GTA’s strategic focus on strengthening the aerospace and defence ecosystem through cross-border commercial cooperation, talent development, research partnerships and long-term capability building, aligned with evolving regional industry needs.
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
FTG Reports Strong Q1 2026 Results with Double-Digit Revenue Growth and Rising Backlog
04/09/2026 | Firan Technology Group CorporationIn Q1 2026, the Corporation grew organically. FTG is strategically investing its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. The company's achievements in Q1 2026 demonstrate this commitment, laying a strong foundation for future growth.