-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
GÖPEL electronic Develops X-BUS
June 22, 2022 | GÖPEL electronicEstimated reading time: 1 minute

GÖPEL electronic has developed X-BUS, a new technology for the universal emulation of serial bus interfaces for use in electronics development and production. As a component of the SYSTEM CASCON software, the X-BUS technology enables a purely software-supported definition of bus protocols. This means that less hardware is required for embedded testing and programming.
Modern test and programming systems are always faced with the challenge of controlling a wide variety of bus interfaces (e.g. serial bus interfaces such as SPI, I²C, JTAG or SWD). In addition, these buses can exist in a wide variety of configuration levels and modes, which further intensifies the problem. For bus communication, the test and programming systems have to have corresponding hardware control units, so-called controllers. The type and number of controllers change constantly depending on the target devices connected. The newly developed X-BUS method addresses this problem and enables flexible control of a wide variety of bus interfaces on the basis of a single control unit. The flexibility of the virtually universal controller is ensured by a specific emulation procedure in conjunction with programmable hardware. This enables highly dynamic switching between diverse bus protocols without time-consuming re-initialisation or hardware reconfiguration.
With a reduced hardware effort, however, the workflow for use remains constantly identical, independent of the actual protocol. Particularly valuable for the user is the possibility to define own protocol sequences via the so-called X-BUS scripting and to port them to compatible test and programming systems without restrictions or licensing and independent of the system supplier. This considerably increases the degree of freedom for the user and also reduces costs. In addition, performance-optimised and protocol-specific predesigned IP (intellectual property) with the corresponding command scope is also available. Based on the features mentioned, highly flexible test and programming systems with maximum performance can be realised at reduced costs and with a high degree of freedom for the user.
The X-BUS method is fully integrated into the GÖPEL electronic software platform SYSTEM CASCON and compatible with the hardware controllers SCANFLEX II and SCANBOOSTER II.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
BAE Systems Receives $12 Million Contract from L3Harris
07/25/2025 | BAE SystemsBAE Systems has received a $12 million contract from L3Harris to support the modification of two Gulfstream G550 aircraft into airborne electronic attack (EA) platforms for the Italian Air Force.
Southwest Antennas Secures First Major European Order for their Permanent Mounting Kits
07/24/2025 | Southwest AntennasSouthwest Antennas is proud to announce the receipt of its first major European order for the company’s Permanent Mounting Kits, marking a significant milestone in its international expansion efforts.