-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec Meets Demand for Taiyo LPI Solder Mask Products in Europe
June 28, 2022 | VentecEstimated reading time: 2 minutes

Following Ventec’s announcement of its exclusive distribution agreement with Taiyo, customers in mainland Europe & the UK are now guaranteed reliable, immediate and flexible access to the full color range of Taiyo Liquid Photoimageable (LPI) Solder Mask inks. Quickest order to delivery turnaround times are guaranteed through Ventec’s fully managed and controlled supply chain from its UK and Germany facilities. With comprehensive inventory availability in booth locations of the full range of colors from Taiyo's PSR-4000 and PSR-4100 range, Ventec meets the increasing demand from European high mix PCB manufacturers for LPI solder mask inks in Europe.
The Taiyo PSR-4000 series and PSR-4100 (two-component, alkaline developable LPI solder mask products) are now immediately available to customers in the EMEA region in the complete range of colors:
- Black
- White
- Green
- Dark green
- Blue
- Yellow
- Red
Fully stocked and fulfilled from Ventec’s distribution hubs in Germany and the United Kingdom, the LPI range is supplied in pre-measured 2.8 and 1.2 kilo containers. The products are Directive 2002/95/EC and RoHS compliant and designed to be user friendly with wide processing latitudes, low odor, fast developing and good resistance to alternate metal finishes such as ENIG and immersion tin.
“With our long-term strategy to continuously invest in ownership and control of our complete sales process and supply chain, Ventec is well known for logistics excellence. Through our long-term partnership with Taiyo as their exclusive pan-European distributor, and our stock capacity increase at our distribution centers in the United Kingdom and in Germany, we are eradicating the former supply challenges for LPI solder masks products in Europe. Immediate availability from stock and flexible shipping options allow our customers controlled and reliable access to stock inventory at the level and time they require for uninterrupted manufacturing,” says Mark Goodwin, COO EMEA and America of Ventec.
Alongside its core PCB-base material ranges, the Taiyo product availability further strengthens Ventec’s position as a leading one-stop shop for high-quality PCB materials in Europe.
Ventec International Group Co., Ltd. (6672 TT) is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- View other titles in our full I-007e book library here
Suggested Items
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.