Cadence, Intel Foundry Services Collaborate to Accelerate Innovation
June 29, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced it has joined the new Intel Foundry Services (IFS) Cloud Alliance to enable customers to leverage scalable design tools from Cadence and the compute power of the cloud. Through the collaboration, users have access to the production-proven Cadence® portfolio and Intel advanced process and packaging technologies in a secure, cloud-based design environment. Using a cloud-based environment, customers can move entire electronic design automation (EDA) flows or specific peak workloads to the cloud as needed, achieving greater efficiency and faster time to market.
By joining the IFS Cloud Alliance, Cadence brings the extensive experience it has gained by working with thousands of customers to accelerate innovation with its proven cloud solutions. To address complex design workloads, the industry-leading, production-proven Cadence Cloud portfolio offers mutual IFS and Cadence customers a full breadth of cloud offerings via highly flexible business models. Over the years, Cadence Cloud portfolio users have successfully accelerated turnaround times for EDA workloads from a few months to a few weeks, improved overall cost efficiency and increased engineering productivity.
“The IFS Cloud Alliance brings easily accessible and scalable compute to help our customers in accelerating their designs, making the cloud accessible to startups, firms with small in-house design teams and companies with established on-premises compute farms alike,” said Rahul Goyal, vice president and general manager of design ecosystem enablement at Intel Foundry Services. “We look forward to helping users achieve design success with the powerful combination of our advanced process and packaging technologies and Cadence design tools.”
“Designing for today’s emerging applications—5G, automotive, industrial internet of things, hyperscale computing, artificial intelligence/machine learning and more—requires the advanced compute power of the cloud,” said Mahesh Turaga, vice president, Cloud Business Development at Cadence. “By joining the IFS Cloud Alliance, we’re enabling joint customers to achieve productivity, scalability, security and flexibility goals with our design tools, the Cadence Cloud portfolio and Intel advanced process and packaging technologies while also helping them speed time to market.”
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.