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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Seems well-timed, actually. Trade show season kicks off with the first major conference in early October and continues into the spring of 2023. So, if you haven’t yet spent time with this association news, now’s your chance. Have a great weekend, everyone!
IPC Symposium Puts Spotlight on IC Substrate and Package Assembly
Published September 9
This inaugural two-day symposium on advanced packaging technology aims to move past the hype and focus on the business and technology for IC packaging. Twenty-eight speakers will fill out eight different sessions. For industry professionals for whom packaging advanced packaging R&D is of interest, this symposium is a must. Get all the details from IPC here.
Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits
Published September 12
Industry pioneer and I-Connect007 columnist Joe Fjelstad sees a rise in interest in flex circuitry applications. Joe updates us on the progress in developing stretchable materials for use in applications such as wearable devices. He also highlights the work done by the NextFlex organization to provide a demonstration center which engineers can use as a lab space to get comfortable with flex materials. If you’re looking into how flex works for your applications, click through here.
Women’s Leadership Program Announces Presentation Program during SMTA International 2022
Published September 15
SMTA is sponsoring a Women’s Leadership Program as a part of the upcoming SMTA International 2022 conference and exposition in Minneapolis. Chairing the two presentation sessions and the social to follow are Tanya Martin, Jessica Molloy, Debbie Carboni, Julie Silk, Michelle Ogihara, and Sherry Stepp. The event is free; everyone is welcome to attend. Find more information here.
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
Published September 14
Oct. 20 in Shanghai is where ZESTRON and iNEMI will host a workshop on the requirements and challenges facing electronics reliability for automotive applications. The speakers list is a deep pool of automotive electronics talent. If automotive is your area of interest, this is a valuable resource.
Pricing Strategies With Michael Carano
Published September 13
We spoke with Mike Carano, vice president of quality at Averatek, I-Connect007 columnist, and member of the IPC Thought Leaders Program, about the current market pressures on pricing. Carano had some interesting insights to share on the subject, and some strategies for increasing margins through pricing, yield and technology improvements. Spoiler alert: Many fabs are clawing back margin they gave up over the years.
Passing the Test With SMTA’s Rob Boguski
Published September 14
Andy Shaughnessy recently spoke with Rob Boguski, president of Datest, an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years. Whether test is your jam, or SMTA long-range planning is, you certainly should give this interview a read.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.
Hannah Nelson: The Inspiring Journey of an Emerging Engineer
03/11/2025 | I-Connect007 Editorial TeamAt last year’s IPC APEX EXPO, former IPC Emerging Engineer Hannah Nelson had the opportunity to reflect on her inspiring journey into the world of engineering, from her education at Valparaiso University to her internship and her first job at Texas Instruments. From pivotal moments and the unexpected turns that helped shape her early career and passion for electrical engineering, her story highlights the importance of interdisciplinary collaboration, taking opportunities that arise early on, finding confidence in one's voice, and the rewards of pursuing one's passions within the engineering field.