Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Seems well-timed, actually. Trade show season kicks off with the first major conference in early October and continues into the spring of 2023. So, if you haven’t yet spent time with this association news, now’s your chance. Have a great weekend, everyone!
IPC Symposium Puts Spotlight on IC Substrate and Package Assembly
Published September 9
This inaugural two-day symposium on advanced packaging technology aims to move past the hype and focus on the business and technology for IC packaging. Twenty-eight speakers will fill out eight different sessions. For industry professionals for whom packaging advanced packaging R&D is of interest, this symposium is a must. Get all the details from IPC here.
Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits
Published September 12
Industry pioneer and I-Connect007 columnist Joe Fjelstad sees a rise in interest in flex circuitry applications. Joe updates us on the progress in developing stretchable materials for use in applications such as wearable devices. He also highlights the work done by the NextFlex organization to provide a demonstration center which engineers can use as a lab space to get comfortable with flex materials. If you’re looking into how flex works for your applications, click through here.
Women’s Leadership Program Announces Presentation Program during SMTA International 2022
Published September 15
SMTA is sponsoring a Women’s Leadership Program as a part of the upcoming SMTA International 2022 conference and exposition in Minneapolis. Chairing the two presentation sessions and the social to follow are Tanya Martin, Jessica Molloy, Debbie Carboni, Julie Silk, Michelle Ogihara, and Sherry Stepp. The event is free; everyone is welcome to attend. Find more information here.
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
Published September 14
Oct. 20 in Shanghai is where ZESTRON and iNEMI will host a workshop on the requirements and challenges facing electronics reliability for automotive applications. The speakers list is a deep pool of automotive electronics talent. If automotive is your area of interest, this is a valuable resource.
Pricing Strategies With Michael Carano
Published September 13
We spoke with Mike Carano, vice president of quality at Averatek, I-Connect007 columnist, and member of the IPC Thought Leaders Program, about the current market pressures on pricing. Carano had some interesting insights to share on the subject, and some strategies for increasing margins through pricing, yield and technology improvements. Spoiler alert: Many fabs are clawing back margin they gave up over the years.
Passing the Test With SMTA’s Rob Boguski
Published September 14
Andy Shaughnessy recently spoke with Rob Boguski, president of Datest, an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years. Whether test is your jam, or SMTA long-range planning is, you certainly should give this interview a read.
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.