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TRI at SMTA Silicon Valley Expo & Tech Forum 2024

11/12/2024 | TRI
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join the SMTA Silicon Valley Expo & Tech Forum 2024 on December 5, 2024, at the Fremont Marriott Silicon Valley.

Electronics Manufacturing Association Statement on U.S. Election Results

11/08/2024 | IPC
John Mitchell, President and CEO of IPC, the global electronics manufacturing industry association, issued the following statement on the United States’ election results:

Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process

11/08/2024 | Michelle Te, IPC Community
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.

Nolan's Notes: The Rise (and Risk) of Data

11/05/2024 | Nolan Johnson -- Column: Nolan's Notes
Last month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.

Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs

10/31/2024 | Team NCAB -- Column: Fresh PCB Concepts
PCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
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