-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Seems well-timed, actually. Trade show season kicks off with the first major conference in early October and continues into the spring of 2023. So, if you haven’t yet spent time with this association news, now’s your chance. Have a great weekend, everyone!
IPC Symposium Puts Spotlight on IC Substrate and Package Assembly
Published September 9
This inaugural two-day symposium on advanced packaging technology aims to move past the hype and focus on the business and technology for IC packaging. Twenty-eight speakers will fill out eight different sessions. For industry professionals for whom packaging advanced packaging R&D is of interest, this symposium is a must. Get all the details from IPC here.
Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits
Published September 12
Industry pioneer and I-Connect007 columnist Joe Fjelstad sees a rise in interest in flex circuitry applications. Joe updates us on the progress in developing stretchable materials for use in applications such as wearable devices. He also highlights the work done by the NextFlex organization to provide a demonstration center which engineers can use as a lab space to get comfortable with flex materials. If you’re looking into how flex works for your applications, click through here.
Women’s Leadership Program Announces Presentation Program during SMTA International 2022
Published September 15
SMTA is sponsoring a Women’s Leadership Program as a part of the upcoming SMTA International 2022 conference and exposition in Minneapolis. Chairing the two presentation sessions and the social to follow are Tanya Martin, Jessica Molloy, Debbie Carboni, Julie Silk, Michelle Ogihara, and Sherry Stepp. The event is free; everyone is welcome to attend. Find more information here.
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
Published September 14
Oct. 20 in Shanghai is where ZESTRON and iNEMI will host a workshop on the requirements and challenges facing electronics reliability for automotive applications. The speakers list is a deep pool of automotive electronics talent. If automotive is your area of interest, this is a valuable resource.
Pricing Strategies With Michael Carano
Published September 13
We spoke with Mike Carano, vice president of quality at Averatek, I-Connect007 columnist, and member of the IPC Thought Leaders Program, about the current market pressures on pricing. Carano had some interesting insights to share on the subject, and some strategies for increasing margins through pricing, yield and technology improvements. Spoiler alert: Many fabs are clawing back margin they gave up over the years.
Passing the Test With SMTA’s Rob Boguski
Published September 14
Andy Shaughnessy recently spoke with Rob Boguski, president of Datest, an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years. Whether test is your jam, or SMTA long-range planning is, you certainly should give this interview a read.
Suggested Items
TRI at SMTA Silicon Valley Expo & Tech Forum 2024
11/12/2024 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join the SMTA Silicon Valley Expo & Tech Forum 2024 on December 5, 2024, at the Fremont Marriott Silicon Valley.
Electronics Manufacturing Association Statement on U.S. Election Results
11/08/2024 | IPCJohn Mitchell, President and CEO of IPC, the global electronics manufacturing industry association, issued the following statement on the United States’ election results:
Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
11/08/2024 | Michelle Te, IPC CommunityPCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
Nolan's Notes: The Rise (and Risk) of Data
11/05/2024 | Nolan Johnson -- Column: Nolan's NotesLast month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.