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iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
October 5, 2022 | iNEMIEstimated reading time: 1 minute

Join iNEMI to discuss reliability requirements and challenges posed by the ever-increasing electronics found in today’s automobiles. This workshop will be hosted by ZESTRON at their North Asia Analytical Center & Technical Center in Shanghai on Thursday, October 20, 2022.
Automotive electronics is expected to be one of the fastest growing segments in the electronics industry. Automobiles are incorporating more electronics from various industry sectors that have not been optimally designed for use in the automotive environment where conditions are significantly more challenging. Challenges include high power, high and low temperature extremes, vibration, shock, exposure to dirt and contaminants, moisture, chemicals, radiation and gasses, plus reliability expectations beyond typical consumer electronics.
This workshop will provide an interactive forum where participants can discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues effecting the electronics in EVs, including PCBs, solder joints, components, and subsystems
- Material characterization, failure analysis, reliability modeling, standards, and specifications
- Knowledge gaps and collaboration opportunities to address common issues facing the automotive supply chain to speed material and technology development and to mitigate reliability risks and improve yield and quality
The agenda includes speakers from:
- Binjiang Institute of Zhejiang University
- Continental
- ESI Automotive
- IMI Technology
- SAIC-VOLKSWAGEN
- NXP Semiconductors
- NIO
- ZESTRON
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
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