-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Yield Engineering Systems Partners with Benchmark for Global Engineering and Manufacturing Support
October 10, 2022 | PRNewswireEstimated reading time: 1 minute
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced it is partnering with Yield Engineering Systems (YES) to transfer the manufacturing of the YES flagship product line to its facility in Malaysia, as well as providing engineering and manufacturing support for YES's upcoming innovative modular wet process systems in the Phoenix, Arizona area.
"We have developed a strong partnership with Benchmark built on trust and our combined expertise," said Ramakanth Alapati, Chief Executive Officer of YES. "We look forward to working closely with the team to bring our technology to a wider market, and to further expanding our footprint in the semiconductor capital equipment industry as the need for semiconductor manufacturing support continues to grow worldwide."
YES is at the leading edge of material modification and surface enhancement solutions. The company's patented technologies significantly enhance the speed, reliability, and cost-effectiveness of semiconductor production processes. YES's thermal, deposition, and wet process systems provide critical technology to semiconductor, life science, and display manufacturers large and small as they work to meet the demand for semiconductors, genomics, point of care diagnostics, and innovative displays.
Benchmark's Phoenix operation will be leveraging the company's deep expertise in the semiconductor capital equipment market, including mechatronic engineering, precision machining, and sub-system assembly. The partnership comes at a critical time as the CHIPS Act has created a flurry of activity around the semiconductor industry and demand for organizations supporting the industry has risen dramatically.
"YES is helping solve critical problems for their customers in the fast-growing semiconductor manufacturing industry," said Jeff Benck, president and CEO, Benchmark. "We're proud to be selected as their strategic partner and look forward to working hand-in-hand with their team to help bring their technology to market to meet the demand for semiconductor capital equipment."
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.